The world’s largest chip assignment TSMC is founding the European Union Design Center (EuDC) in Munich. In this center, TSMC wants to design chip designs together with customers, which then produces either TSMC itself or the TSMC-Joint venture European Semiconductor Manufacturing Company (ESMC). With the EuDC, TSMC wants to consolidate cooperation with European customers. The EUDC is expected to open in the third quarter of 2025.
All manufacturing processes from TSMC and ESMC provide selection. In Dresden, ESMC produces chips with structural widths of 28 to 12 nanometers in Dresden from the end of 2027. The focus is on microcontrollers for cars with a new, integrated but non -fleeting resistive random access memory (RRAM) and magnetoresistive random access memory (MRAM), which TSMC also wants to develop in Munich. In Taiwan, on the other hand, production with 2-NM structures (N2) is starting this year.
TSMC mentions industrial applications, artificial intelligence (AI), telecommunications technology and Internet of Things (IoT) as other areas of application for ECDC designs. The EUDC is to work with the nine previous TSMC design centers in Taiwan, the USA, Canada, China and Japan.
Apple already located in Munich
In Munich, among other things, Apple already maintains a research center that the manufacturer took over from Intel in 2019. With the know-how there, Apple’s first own mobile phone modem C1 for the iPhone 16E was created. Apple Munich is also said to have developed its own M processors. Cooperation with TSMC at the location would not be surprising.
So far, TSMC has not commented on the planned number of employees in Munich. Among other things There are already job advertisements on LinkedIn.
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